M82 Автоматический вафельник

This equipment is the film mounting equipment operated by means of manual material loading and unloading, automatic film stretching, automatic film mounting, automatic film pressing and manual cutting. The equipment is suitable for attaching protective film before cutting.

Product Characteristics

•The film mounting force is generated from the separate guide pillar cylinder thrust; the acting force is stable and uniform, and the parameterized adjustment is available for the film mounting pressure

•Vacuum adsorption table with the anti-static and Teflon treatment, and controllable temperature from the indoor temperature to 100℃

•The wafer placement table adopts the floating design, with adjustable flatness and adjustable height, so that it is compatible for the wafer with the wider range of thickness, and the floating design can protect the wafer better

•The wafer positioning adopts the marked line positioning mode

•The release layer automatically winds for withdrawal, and the withdrawal force is adjustable; the disassembly for the release layer is convenient and easy

•No tool is required for the locking in front of the film material and the film releasing tube

•Touch operation panel, with visualized and compact interface

•The nitrogen spring spreader is adopted, which is more labor-saving for the operation

•The guide rail location pin structure is adopted for the alternations between 6 " and 8 ", and the operation is convenient and easy

•The automatic film adsorption and film stretching speed is uniform, stable and reliable

•The imported well-known brands are adopted for all the main components

Performance

Wafer yield: ≥99.9%

Film mounting quality: No bubbles (excluding the fragmentized granulated bubbles)

Capacity: ≥90 pieces per hour

Equipment specifications